At this level, there is no real difference between a silicon integration or a package integration .... they both produce very tiny products.Are you saying its actually the same transducer or rather that the sensor package contains 2 transducer circuits (pressure and temp) that might interact with each other in a failure mode?
Also, the temperature sensor is extremely small (a very very very tiny silicon cell) and it is usually integrated into the same piece of semiconductor device that includes the ADC that reads the pressure sensor.
A temperature sensor - sitting very close to the pressure sensor - is necessary because the response of the pressure sensor is not linear vs. the temperature and as such it needs constant compensation.
If you want to know more about the subject you can read the datasheet of a common pressure sensor such as the MS5535C
Alberto (aka eDiver)
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The processor in the dive computer uses the temperature to "attempt to correct" the linearity error of the pressure sensor....... Can you explain this more fully? .....
Alberto (aka eDiver)